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After Intel's release of the revolutionary P35 chipset, the Team Group immediately released its first DDR3 memory module – the Xtreem DDR3 1066. DDR2 memory can also be run at the same frequency but needs voltage of 2.2V. DDR3 1066 memory needs only 1.5V, providing the advantage of low power consumption.
According to JEDEC specifications, the nearly 25% increase in clock speed between DDR2 800 and DDR3 1066 delivers single channel bandwidth performance of over 8.5GB/sec. The Xtreem DDR3 1066 advantage doesn’t stop there. It is designed to use low-latency timings of 7-7-7-21 (tCL-tRCD-tRP-tRAS) which outstrips the performance of competing memory modules using timings of 8-8-8-24. This makes the best use of the 1066MHz memory frequency using voltage of just 1.5V, demonstrating the Team Group’s superior R&D capability.
Quality comes first at Team Group so the Xtreem DDR3 1066 is manufactured using 128x8 BGA memory chips with a maximum capacity of 1GB to satisfy the demand for memory from 3D intensive games. The memory modules are also covered with aluminum heat sinks in a novel X-shaped design to present a distinctive appearance that emphasizes the extreme performance offered by the Xtreem series.
| Scheda Tecnica: |
| Module specification |
240Pin Unbuffered DIMM Non ECC |
| Die layout |
64x8,128x8 |
| Data transfer bandwidth |
10,664MB/Sec (PC3 10660) |
| Capacity |
2GB Kit (2x1GB) |
| CL-value |
7-7-7-21-2T |
| Working voltage |
1.75V~1.85V |
| PCB structure |
6-layer PCB |
| Extra features |
Aluminum heat-sink(4-6 cm fan can be set-up on heat spreader by user request (optional)) |
| Warranty |
Lifetime warranty |
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